![]() UKAM Industrial Superhard Tools Division of LEL Diamond ToolsĢ8231 Avenue Crocker, Unit 80 Valencia, CA 91355 Phone: (661) 257-2288 Fax: (661)Ģ002-2009. The Right Dicing Blade for your Application Typical thicknesses are between 100 - 650 microns. Wafers are typically available in sizes up & GaAs are the two most common materials used for Microns (resin) and 7 - 15 microns (sintered)Ĭoolants may reduce chipping and improve surface finish Glass, HTCC (High Temperature Co-fired Ceramics).Ĭommon materials: Glass, Quartz. Temperature Co-fired Ceramics), LTCC (Low Temperature Co-fired To create a large radius on the blade edge ![]() The Right Diamond Blade for your Application (151kb)īLADE APPLICATION RECOMMENDATIONS & CASE STUDIES The Most from your Diamond Drilling Operation (543kb) The Most from your Diamond Sawing Operation (125kb)
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